Monday, April 16, 2007

Tessera in IBM's shadow

Tessera formally launches its MicroPILR approach to stacked packaging today, based on the technology it acquired back in May 2005 from Japan's North Corp. Little did the company know its announcement would get upstaged by news from IBM last week about Big Blue's advance in the more forward-looking through-silicon via die interconnect.

Whatever the marketing climate, observers are taking a skeptical look at MicroPILR, which uses tiny columns to pack more links between two stacked chips. Neither the economics of this approach nor the extent of buy in from key substrate makers is clear, observers say. What's more other package-on-package technologies are already ramping into high gear with the backing of Jedec standards and known tool flows. This could be a tough sell for Tessera.

No comments:

 
interconnects