Monday, April 02, 2007

Last call for a Hoti

April 9 is the deadline to submit a paper for the Hot Interconnects conference. The annual confab at Stanford University is a back-to-school must for I/O mavens in fields ranging from on-chip processor-memory interconnects to wide-area networks. Organizers say "Contributions should focus on real experimental systems, prototypes, or leading-edge products and their performance evaluation." Amen.

So, get those papers in ASAP, and don't forget to call me a couple weeks before the show to tip your news!

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